Classification of targets

According to the application, it mainly includes targets for semiconductor applications, targets for recording media, targets for display films, optical targets, and superconducting targets. Among them, Titanium Nitride Sputtering Target for semiconductor applications, targets for recording media, and display targets are the three types of targets with the largest market scale.

Titanium Rotary Sputtering Target shapes include cuboid, cube, cylinder, and irregular shapes. The cuboid, square and cylindrical targets are solid. During the sputtering process, the annular permanent magnet establishes an annular magnetic field on the surface of the target, forming an etched area on the annular surface with equidistant distances between the axes. The disadvantage is that the film deposition thickness is uniform. The performance is not easy to control, and the utilization rate of the target is low, only 20%~30%. At present, the rotating hollow tube magnetron sputtering target is popularized at home and abroad.