Sputtering target preparation process and characteristics

We all know that there are many kinds of targets, such as alloys, oxides, copper, aluminum, stainless steel, nickel, titanium and other metals, and according to different metals, various target preparation methods are required.

Different process methods and characteristics of sputtering targets

1. Powder sintering method

Generally hot pressing, vacuum hot pressing, hot isostatic pressing and other processes will use the powder sintering method.

(1) Features: This preparation process has the characteristics of easy to obtain uniform fine-grained structure, saving raw materials, and high production efficiency. The key lies in the selection of high-purity, ultra-fine powder as the raw material, and the selection of forming and sintering technology that can achieve rapid densification, so as to ensure the low porosity of the target and control the grain size. The introduction of impurity elements needs to be strictly controlled during the preparation process.

(2) Suitable metals: suitable for W, Mo, Ru and other insoluble metals and alloys.

2. Melting and casting method

Generally, vacuum induction melting, vacuum arc melting, vacuum electron bombardment melting and other processes will use the melting and casting method.

(1) Features: Compared with the powder method, the smelting casting method has low impurity content in the smelting alloy target, especially the gas impurity content, and can be high-density and large-scale, but for metals with large differences in melting point and density, smelting It will be difficult to obtain alloy targets with uniform composition.

(2) Applicable metals: suitable for Al, Ti, Ni, Cu, Co, Ta, Ag, Pt and other metals with good plasticity.

3. Extrusion process

Generally, hot extrusion, cold extrusion, warm extrusion, etc. will use the extrusion process.

(1) Features: It is mainly used to prepare metal and alloy rotating targets with good plasticity.

(2) Applicable metals: suitable for Al, Cu, Zn and other metals with good plasticity.

4. Plasma spraying method

General vacuum, water stabilization, gas stabilization plasma spraying and other processes will use the plasma spraying method.

(1) Features: It can be used to prepare rotating targets such as brittle metals and alloys, ceramic targets, etc.

(2) Applicable metals: suitable for rotating targets such as Cr, Si, oxides, etc.

Through the above introduction, it can be known that the Titanium Nitride Sputtering Target preparation methods mainly include powder sintering method, smelting casting method, extrusion process, plasma spraying method, etc. Different processes have different application occasions, different characteristics, and different applicable metals, so different metals are used. The preparation process is different.