What are the main performance requirements of titanium targets?

Titanium tube target is made of purity, which is one of the main performance indicators of the target material, because the purity of the target material greatly affects the performance of the thin film. So, what are the main performance requirements of titanium targets? The following is introduced by titanium tube target manufacturers.
purity

Purity is one of the main performance indicators of the target, because the purity of the target has a great influence on the performance of the film. However, in practical applications, the purity requirements of the target materials are also different. For example, with the rapid development of the microelectronics industry, the size of silicon wafers has grown from 6", 8" to 12", while the width of wiring has been reduced from 0.5um to 0.25um, 0.18um or even 0.13um. The previous target purity was 99.995% Can meet the technical requirements of 0.35umIC, and the preparation of 0.18um lines requires 99.999% or even 99.9999% for the purity of the target material.

Impurities in the solids of the target and oxygen and water vapor in the pores are the main sources of contamination of the deposited film. Different targets have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.
density
In order to reduce the pores in the solids of the target and improve the performance of the sputtered film, the target is usually required to have a higher density. The density of the target not only affects the sputtering rate, but also affects the electrical and optical properties of the film. The higher the target density, the better the film performance. In addition, increasing the density and strength of the target allows the target to better withstand the thermal stress during sputtering. Density is also one of the key performance indicators of the target.
Grain size and grain size distribution

The target material is usually polycrystalline and the grain size can be in the order of microns to millimeters. For the same target material, the sputtering rate of a target with fine grains is faster than that of a target with coarse grains; and the thickness distribution of the film deposited by sputtering with a target with a small difference in grain size (uniform distribution) is more uniform .

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